AMD presents its new chips for laptop PCs, the Ryzen AI 300, which promise significant performance gains compared to its competitors and above all the most efficient AI chip on the market.
It was at the Computex show that AMD unveiled its new Zen 5 architecture for processors desktop and mobile. For laptops, the manufacturer claims to offer “best processors in the world for PC Copilot+», a real snub to the recent Snapdragon X chips recently presented by Qualcomm.
Processors for AI PCs, but not only
Before even talking about the Zen 5 architecture for its mobile processors, AMD is emphasizing its brand new NPU, its chip dedicated to neural processing. Entitled XDNA 2, it reached the 50 TOPS ( Trillions Operations per Second ) and exceeds both Microsoft’s prerequisites for Copilot+ experiences, but also all its competitors which cap at 45 TOPS for Qualcomm and 38 TOPS for Apple’s M4 chip.
AMD thus promises energy efficiency that can double, with the NPU offloading the processor from the various Windows 11 tasks related to AI. In addition, the manufacturer exploits in its chip the performance of 8-bit calculation (INT8) with the precision of 16-bit (FP16), the best of both worlds.
For the rest, these Ryzen 300s rely on Zen 5 cores up to 15% more efficient within two chips: the Ryzen AI HX370 with 12 cores and 24 threads that can turbo up to 5.1 GHz (36 MB of L2 and L3 cache) and the Ryzen AI 9 H365 and its 10 cores and 20 threads capping at 5 GHz (34 MB of L2 and L3 cache).
AMD wants to afford the Snapdragon X and the Apple M3
Without too much surprise, AMD obviously has the brand new Snapdragon X Elite in its sights and announces performance gains ranging from 5 to 60% depending on the different benchmarks,no emulation required» specifies the manufacturer.
Same story in its comparisons with Intel and especially the Apple M3 in the ultraportable segment, with multitasking performance 70% higher than the Apple chip and even 98% in 3D rendering on Blender.
AMD, however, was not very talkative on two points: its RDNA 3.5 integrated GPU architecture that can carry up to 16 computing units and above all, the energy efficiency of its new chips and potential autonomy. Knowing that the announced thermal envelope can go up to 54W, like the Zen 4 mobile processors with NPU, we can expect similar performances.
As for the Ryzen 9000 range ondesktop,These new mobile processors are expected in July in the first laptop PCs already announced by manufacturers like Asus, MSI and Acer.
