Intel Core Ultra 200V processor
Intel has confirmed the arrival of its new processor architecture, Lunar Lake. While specific details on offerings, SKUs, and engraving fineness have yet to be publicly disclosed, leaks attempt to fill in these gaps.
According to these reports, Lunar Lake’s Core Ultra 200V chips will mark a first for Intel, as they will be manufactured entirely by TSMC, a major player in semiconductor manufacturing.
TSMC would use its N3B (3 nm) manufacturing process for the processor part of the Core Ultra 200V, while the platform’s control module would be based on the N6 (6 nm) process. The move marks Intel’s move away from its tradition of in-house manufacturing, opting instead for TSMC’s expertise and advanced capabilities in etching processes.
Lunar Lake is expected to be officially announced by the end of the third quarter of this year. This new generation will introduce the Lion Cove architecture for the P-Cores, the Skymont architecture for the E-Cores, as well as the Xe2-LPG architecture for the iGPU part.
The Arrow Lake-S, also planned in the Core Ultra 200 lineup, will specifically target high-end desktops and laptops, representing a significant step forward for Intel in the high-performance segment.
