Indeed, from the start of next year, the group's Taiwanese factories will be able to begin producing 2nm chips. Well, at least for the most modern structures.
A manufacturing process which still promises significant economies of scale and which should drastically reduce chip consumption. On the other hand, we should not count on the deployment of this technology on American soil before, at best, 2027/2028. It will then be a question of developing the second fab (name of the semiconductor factories) on the Phoenix side.
Why wait until 2027/2028 for 3 nm and, above all, 2 nm in the United States? Quite simply because of a Taiwanese law which authorizes its companies to produce chips abroad on the express condition that they are not the last generation: in other words, so that 2 nm can be produced in Arizona, we must wait for the next process – A16 – to be deployed in Taiwan.
This is also what explains why currently the TSMC fab in Phoenix is limited to 4 nm while we are talking about 3 nm on the island of Taiwan. After all, there is no reason why Taiwan should not prioritize local production.
