The Huawei Mate 60 Pro had already been a flash in the sky for the United States, with the integration under the hood of a Kirin 9000s chip, engraved with a precision of 7 nanometers. A success which, if it was still far from what is best in the field (the A17 Pro chip of the iPhone 15 Pro is thus engraved in 3 nanometers), still showed that the sanctions were only relatively slow down Chinese development.
This is proven by the findings of the online repair specialist iFixit and the consulting company TechSearch International, which opened the hood of the latest Pura 70. A smartphone that is even more “self-sufficient” than the Mate 60 Pro. Indeed, the device benefits on the one hand from an advanced chip based on the Kirin 9000s, produced by the local founder Semiconductor Manufacturing International Corp (SMIC), which they have named Kirin 9010.
On the other hand, perhaps more importantly, the Pura 70 has a NAND flash memory chip, which, according to the two specialists, several elements indicate would have been manufactured by Huawei’s subsidiary, HiSilicon. For comparison, the same component of the Huawei Mate 60 Pro was supplied by the South Korean company SK Hynix.
