A computer memory capable of withstanding extreme temperatures has just been developed by American researchers. This innovation could significantly improve the use of electronics in hostile environments, such as nuclear reactors orexploration planetary.
Crédit image: Brenda Ahearn, Michigan Engineering
This technology, of the ECRAM type, is based on the movement of ions ofoxygen rather than electrons. Unlike traditional semiconductors in siliconwhich become unstable above 150°C, this memory works perfectly at over 600°C. It uses two layers (one in tantalum, the other in tantalum oxide) separated by a solid electrolyte, allowing information to be stored stably. The mechanism is similar to that of a battery. Oxygen ions move between layers under voltage, changing the conductivity of the material. This variation between conductor and insulator states encodes binary data. The process is reversible and can be repeated without loss of performance.
The potential applications are vast. This memory could equip space probes destined for Venus, where temperatures reach 465°C. It would also be useful in fusion reactors or aircraft engines, where extreme heat currently limits the use of electronics.
However, this technology has a limitation: it does not work below 250°C. To overcome this problem, the researchers plan to integrate a heating system. This would allow the memory to be used in ambient temperature environments after a warm-up phase.
-Crédit photo: Brenda Ahearn, Michigan Engineering
Current performance is promising. At this stage, the prototype can store a single bit of information for more than 24 hours at 600°C. But researchers estimate that with improvements, this memory could reach capacities of the order of several gigabytes, paving the way for complete computer systems operating in extreme conditions.
Finally, this technology stands out for its low energy consumption. It operates at lower voltages than other high-temperature memories, such as those using ferroelectric materials. This makes it a durable solution for applications demanding performance and reliability.
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