A non-silicone, bendable RISC-V microprocessor that costs less than a dollar to manufacture could be a game changer for smart sensors and wearables

The researchers believe this is a significant step forward in the possibilities of flexible electronic systems. (Image source: Pragmatic)

The newly developed Flex-RV microprocessor, manufactured with flexible IGZO TFTs and based on RISC-V architecture, operates at 60 kHz with a power consumption of less than 6 mW. Its foldability and low-cost design make it ideal for wearables, healthcare devices and smart sensors.

Researchers have developed Flex-RV, a game-changing flexible microprocessor based on the RISC-V processor and manufactured with indium gallium zinc oxide (IGZO) thin film transistors (TFTs). This machine outperforms conventional silicon-based semiconductors (literally) – and here we have a sub-dollar solution for low-power foldable computing.

Flex-RV operates at 60 kHz with a power consumption of less than 6 mW, exhibiting only a 4.3% performance variation, even under tight bending conditions, thanks to its flexible polyimide substrate. Polyimide is specifically used as a substrate in this use case due to its excellent thermal stability, high mechanical strength and chemical resistance.

The processor integrates a programmable machine learning (ML) machine learning system, capable of executing ML workloads through custom RISC-V instructions. This feature supports on-chip AI calculations, meaning Flex-RV could be ideal for emerging applications such as healthcare wearables, smart packaging, and fast-moving consumer goods, especially where the Cost-effectiveness and form factor are essential. Computing requirements in these industries are typically low, and Flex-RV meets these demands while providing flexibility and durability.

The manufacturing process, which relies on IGZO TFTs, significantly reduces environmental impact compared to silicon-based counterparts, especially in submicron dimensions. Additionally, the over-edge printing (OEP) assembly method ensures that the Flex-RV chip can be mounted on flexible printed circuit boards (FlexPCBs) and maintains its operational integrity during mechanical stress testing, withstanding a bend radius of 3mm – which is quite significant for a component of this size.

Given its very low cost, flexible design and ML reach, Flex-RV could become widespread in the future – a vital technology for next-generation wearable electronics, implantable medical devices, and smart sensors.

The FlexPCB (Flexible Printed Circuit Board) on which the chip is assembled and which is then connected to the FPGA card. (Image source: Nature / Pragmatic Semi)
Anubhav Sharma
Ninh Duy

Translator: Ninh Ngoc Duy – Editorial Assistant – 439432 articles published on Notebookcheck since 2008

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